Overview In this role you will develop and optimize packaging media and collaterals to meet reliability, cost, and productivity targets. You will work within Intel's Media Development team to advance assembly packaging technology and drive improvements across processes. You will apply DOE and SPC methods to design robust solutions and assess performance under simulated field conditions. This position offers the chance to contribute to cutting-edge semiconductor packaging milestones and influence technology roadmaps. You will communicate technical innovations and collaborate across cross-functional teams to deliver impactful results.
Compensation / Benefits- competitive pay
- stock bonuses
- health benefits
- retirement plans
- vacation
Responsibilities- Develop and optimize media and collaterals to meet quality, reliability, cost, yield, and productivity targets.
- Design and implement new media and collateral solutions using DOE and SPC.
- Evaluate media and collaterals under simulated field conditions (heat, humidity, temperature cycling, dynamic forces).
- Lead initiatives to identify and mitigate quality and reliability risks with innovative tools and methods.
- Provide technical consultation on media and collateral challenges aligned with milestones.
- Document technical improvements and innovations through research papers and presentations.
Key requirements- Bachelor's degree in mechanical engineering or related field with 6 months of hands-on experience.
- Experience in Equipment Engineering, Mechanical Design, and/or Process Engineering.
- strong analytical skills
- ability to deliver results on complex, time-critical projects
- cross-functional collaboration
- SolidWorks
- AutoCAD
- familiarity with semiconductor packaging processes
