Overview As Senior Staff Manager, you will shape Marvell's sourcing strategy for advanced packaging and test equipment, partnering with Engineering, Operations and Finance to ensure technology readiness and capacity. You will lead supplier negotiations, governance, and risk management across global suppliers and OSAT partners to enable AI data center growth. This role combines strategic sourcing with cross-functional leadership to drive cost, quality and delivery improvements. You will influence roadmaps and supplier ecosystems in a fast-growing semiconductor environment.
Compensation / Benefits- employee stock purchase plan with 2-year look back
- family support programs
- robust mental health resources
- recognition and service awards
Responsibilities- Develop and execute sourcing strategies for advanced packaging, assembly/test operations, semiconductor test equipment, and production test infrastructure
- Lead supplier selection, negotiations, and contract management; manage strategic supplier relationships
- Drive supplier performance improvements across cost, quality, delivery, responsiveness, and technology capability
- Support sourcing for 2.5D/3D packaging, HBM, chiplet architectures, and related substrates
- Collaborate with engineering and operations to align sourcing with roadmaps and capacity plans
- Lead strategic sourcing for test equipment (ATE, burn-in, system-level test, probes/handlers) and related capital purchases
- Own cross-functional initiatives across Product/Package/Test Engineering, Operations, Finance and Quality
- Lead cost optimization activities, should-cost analyses, and savings programs; support budgeting and forecasting
- Assess and mitigate supply risks, develop contingency and alternate sourcing plans
Key requirements- 8+ years in procurement/supply chain/sourcing within the semiconductor industry
- Experience negotiating complex commercial agreements and managing strategic supplier relationships
- Deep understanding of semiconductor manufacturing and product development flows
- Strong analytical, financial, and problem-solving capabilities
- Effective communication and stakeholder management
- strong negotiation
- stakeholder management
- cross-functional collaboration
- Advanced packaging technologies (2.5D, 3D, chiplet integration, HBM, interposers)
- OSAT and assembly/test capabilities
- Semiconductor test equipment (ATE, burn-in, system-level test, probes/handlers)
