Overview In this role you lead and mentor the Optics Operations Product Engineering team to drive AI-driven process improvements and DFx methodologies across silicon and optical components. You partner with design, foundry, packaging, and test teams to optimize yield, quality, and costs while shaping manufacturing strategies. You will accelerate product development from silicon to high-volume manufacturing and strengthen supply chain resilience.
Compensation / Benefits- Medical, dental and vision insurance
- 401(k) with Cisco matching
- Paid parental leave
- Paid holidays and vacation
- Sick time and flexible time off
- Stock grants/RSUs (eligibility may apply)
Responsibilities- Lead an engineering team to deliver state-of-the-art semiconductor wafer products meeting Cisco quality and performance standards
- Partner with cross-functional teams (design, foundry, IC packaging, test, reliability) to exceed yield, quality, and costs targets
- Lead the product engineering team to drive yield & Quality, implement DFx principles and manage products from initial silicon to high volume manufacturing (HVM)
- Collaborate with design & test teams to establish manufacturing and test strategies, including DFT implementation, test hardware specs, and test program creation
- Deliver AI-Driven process transformation to continuously improve quality, yield, and cost through test time reduction and root-cause analysis across design, fab, and packaging
- Create and execute strategies leveraging AI-powered analytics to streamline product development, accelerate failure identification, and enhance yield management
- Coach and upskill junior to senior engineers, fostering technical capabilities and an AI-driven mindset to maximize productivity and efficiency
Key requirements- MS or PhD in Electrical Engineering, Optical Physics, Photonics, or related engineering fields
- 10+ years of semiconductor industry experience as a technical lead, including 5+ years of direct people leadership
- Technical expertise in semiconductor fabrication processes, wafer sort/probe testing, and advanced packaging (2.5D/3D, flip-chip, optical interconnect)
- Proven mentoring skills with the ability to inspire and develop engineers across career stages
- Hands-on mastery of Statistical Process Control (SPC), Design of Experiments, Six Sigma methodologies, and yield management software (e.g., JMP, Spotfire)
- Strategic mindset with deep silicon engineering expertise to guide engineering teams through complex projects
- Direct experience managing technical deliverables with leading foundry ecosystems and OSAT partners
- Mentoring and coaching
- Executive communication and stakeholder management
- Cross-functional collaboration
- Semiconductor fabrication processes
- Wafer sort/probe testing
- Advanced packaging (2.5D/3D, flip-chip, optical interconnect)
