Overview As a Semiconductor Research Engineer, you will drive innovation in device physics, thermomechanical analysis, and materials science to create novel devices and packaging technologies. You will prototype and test advanced interconnects and packaging concepts, collaborating across teams to optimize performance and cost. Your work supports Intel's assembly and packaging platform advances, enabling device miniaturization and high speed signaling. This role offers meaningful impact through translational research and hands on experimentation.
Compensation / Benefits- competitive pay
- stock bonuses
- health benefits
- retirement plan
- paid vacation
Responsibilities- Conduct research using device physics, thermomechanical analysis, and materials science to enable novel devices and systems
- Design and fabricate prototypes to prove concepts for packaging and interconnects
- Perform electrical testing and establish characterization methodologies (DC, RF, pulsing, stress)
- Develop process solutions across lithography, etch, diffusion, CVD, PVD, and CMP
- Plan and execute experiments with device, reliability, and fabrication teams to benchmark against industry standards
- Develop models and measurements to advance understanding of device physics and packaging for future platforms
- Engage with external vendors and researchers to support collaborations and Intel's research pipeline
Key requirements- Advanced experience in semiconductor fabrication processes (lithography, etch, diffusion, packaging design methodologies)
- Advanced experience with simulation tools (Ansys, Abaqus) for FEA and CFD
- Programming skills in Python or MATLAB
- Hands-on experience with experimental setups and data analysis for lab testing
- Experience with advanced packaging technologies, including EMIB and Foveros architectures
- Expertise in Design of Experiments (DOE) and statistical analysis
- Familiarity with materials characterization techniques and external collaboration
- Proven ability to lead technical teams and drive performance improvements
- Strong analytical and communication skills
- leadership and mentoring
- excellent communication
- problem-solving
- semiconductor fabrication
- device physics
- thermomechanical analysis
