Overview In this role you will lead the development and qualification of new supply chain and technology platforms for advanced component applications. You will work in cross functional teams to ensure quality, reliability, volume, delivery and cost objectives. You'll drive testing, validation and supplier collaboration in a highly automated manufacturing environment. This is a high impact position shaping supplier interfaces and stage gate processes for next gen implantable devices.
Responsibilities- Define and deploy technology platforms for new product applications with testing, simulation, and prototyping
- Qualify surface mount components for manufacturing use
- Apply systematic problem solving to resolve quality/performance issues with suppliers and teams
- Lead testing and validation of components for high reliability using use case based tests
- Lead stage-gate approvals, documentation, and sustaining support in an automated factory
- Support new development projects ensuring compliance to internal and industry standards
- Perform failure analysis and drive to root cause with production and prototyping
- Engage with internal and external customers on technical topics
- Assess and communicate with stakeholders to qualify supplier process changes
- Conduct on-site supplier audits, domestically and internationally
Key requirements- 8+ years experience with chip scale packaging, direct bump attach, copper pillar, and similar technologies
- Detailed knowledge of wafer-level packaging, wire bond, encapsulation, and chip attach; materials and processes
- Knowledge of IC packaging failure modes and root cause analysis
- Experience in high reliability electronics manufacturing
- Experience with quality systems and documenting quality-relevant information
- Strong physics-based reasoning
- Failure analysis and root cause corrective action with suppliers
- Proven ability to lead engineering projects and experiments to schedule
- Leadership skills to coach and lead technical staff
- Proficiency with Excel, Word, PowerPoint
- Ability to interface across Quality, Manufacturing, Supply Chain, Test, and Development
- excellent written and verbal communication
- detail-oriented
- leadership and mentoring
- chip scale packaging
- direct bump attach
- copper pillar
