Overview As RFIC Packaging Engineer, you lead RF/microwave packaging development from concept to production, guiding design decisions for cost-effective, high-volume packaging. You collaborate with design, QA, reliability, and suppliers to optimize materials, processes, and assembly. You will troubleshoot packaging issues, model thermal behavior, and contribute to the backend technology roadmap. This role offers the opportunity to shape packaging strategies across multiple technologies in a global manufacturing environment.
Compensation / Benefits- Health, dental, and vision insurance
- Employer-sponsored 401(k) plan
- Paid time off
- Professional development opportunities
Responsibilities- Technical lead for RF/microwave packaging across plastic, ceramic, laminate and metal types
- Collaborate with internal teams and suppliers to select and qualify appropriate packaging technologies and assembly processes
- Establish and update design rules for packaging with vendors and internal engineering
- Implement robust internal and contract-manufacturer assembly processes
- Troubleshoot packaging defects and implement corrective actions
- Provide thermal modeling and application notes for new packages
- Characterize failure modes in collaboration with Quality and analyze materials/process impact
- Support supplier benchmarking and track data to influence backend technology roadmap
Key requirements- MS or BS +3 years in Materials Science, EE/ME with packaging process development and RF/Microwave expertise
- Proven track record from concept to implementation in packaging projects
- Experience with high-volume contract manufacturers and packaging processes
- Deep knowledge of RFIC/Microwave assembly (die attach, flip chip, wire bond, etc.)
- Experience in failure analysis methodology
- Ability to work independently under tight deadlines and manage multiple projects
- Strong written and verbal communication; ability to present data and plans at meetings
- Statistical methods knowledge (DOE, SPC); JMP or Minitab experience
- Knowledge of standards (JEDEC, IPC, EIA, RoHS, WEEE) and reliability testing
- Experience with Solidworks and ANSYS FEA; AutoCAD is a plus
- Finite element analysis for thermal/mechanical problems
- independent work ethic
- strong communication
- teamwork
- RF/microwave packaging design
- thermal analysis and modeling
- DOE/DOE optimization
