Overview In this role you drive power, thermal management, and performance-per-watt for next-gen AMD Adaptive and Embedded Computing products. You will act as a technical link between business, design, platform validation, and engineering teams, shaping decisions that affect multiple products. You'll partner with architecture and product teams to meet customer power and thermal requirements and ensure timely execution. This is an opportunity to impact next-generation ASIC/SoC platforms within a culture that values collaboration and innovation.
Responsibilities- Drive power estimation, power delivery and management, and thermal solutions for FPGA, Adaptive SoCs, Embedded x86, and semi-custom products
- Collaborate with architecture and design teams to address customer power and thermal requirements
- Work closely with internal stakeholders to align efforts and enable timely execution
Key requirements- Experience in planning, architecting and/or designing power and thermal solutions for ASICs, ASSPs or FPGA-based systems
- Strong collaboration skills to work across architecture, design, and product teams
- Knowledge of power and thermal methodologies for complex SoCs and custom ASICs
- collaboration
- independence and accountability
- clear communication
- power estimation
- power delivery
- thermal management
