A
Not Specified Permanent

San Jose, California · USA job

Principal Engineer, Research Science Engineering

Analog Devices

San Jose, California

Job description

Overview

As a process integration engineer, you will define integration specifications and layout rules for next-gen mixed-signal and BCD technologies. You will act as the interface between device engineers and fab process engineers, delivering process integration solutions. You will identify root causes of yield and reliability issues during development and lead qualifications for new tech and fab transfers. This role supports ADI's mission to advance intelligent edge solutions and requires close collaboration with cross-functional teams to drive robust manufacturing outcomes. You will be pivotal in shaping scalable, reliable silicon technologies for high-impact applications.

Compensation / Benefits
  • discretionary performance-based bonus
  • medical, vision and dental coverage
  • 401k
  • paid vacation
  • holidays
  • sick time
Responsibilities
  • Define integration specifications and layout rules for next-generation mixed-signal and BCD technologies
  • Interface between device engineers and fabrication process engineers
  • Provide process integration solutions to device engineers
  • Identify root causes of yield and reliability issues during process development
  • Lead process and product qualification efforts for new technologies and fab transfers
  • Collaborate with cross-functional teams to drive schedule and milestones
  • Plan and manage qualification activities for technology transfers
  • Support packaging knowledge exchange as applicable
Key requirements
  • In-depth knowledge of FEOL/BEOL processes
  • Strong knowledge of DOE for process screening and corner analysis
  • Proven ability to solve unique or complex integrated processing problems
  • Hands-on experience in test structure design, layout, testing, and data analysis
  • Knowledge of device physics and Si reliability characterization methodologies
  • Ability to balance cost, performance, yield, and reliability
  • Strong project management, scheduling, and deadline discipline
  • Excellent communication and collaboration skills
  • Packaging technology knowledge is a plus
  • cross-functional collaboration
  • effective communication
  • project leadership
  • FEOL/BEOL process knowledge
  • DOE and process screening
  • test structure design and data analysis

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