Overview Join onsemi's Technology Development group as an Integration Engineer in Hopewell Junction, NY to drive process and architecture improvements for new products. You will bridge design and manufacturing to enable ramp to volume production and yield gains, impacting automotive and industrial technologies. You'll work cross-functionally to introduce and mature new tech, delivering robust processes and packaging integration. This role offers hands-on impact across product development, process optimization, and technology scaling within a global team.
Compensation / Benefits- competitive benefits package
Responsibilities- Support product development from design through full-scale manufacturing with formal process-change documentation
- Collaborate with Manufacturing Engineering to define manufacturable process recipes meeting yield and reliability targets
- Demonstrate expertise in semiconductor technology, device physics, yields, and manufacturing processes
- Lead novel insulator integration into wafer packaging
- Leverage CPI experience and chip-scale module construction knowledge
- Work on Power FET and Power Module experiences; copper plating and wafer thinning are pluses
- Develop and optimize packaging skills: pick-and-place, sintering, CSP, advanced packaging
- Explore RDL, advanced packaging integration, polyimide, dicing, and module assembly as needed
Key requirements- BS in Engineering or Materials Science; MS+ preferred
- 6-10+ years in semiconductor manufacturing integration and technology development
- Familiar with 5S, 8D, 6-sigma, SPC, DOE, FMEA
- Fluent in English (written and verbal)
- cross-functional collaboration
- clear communication across levels including executive leadership
- independent execution and initiative
- semiconductor technology and device physics
- yield improvement methodologies
- insulator integration into wafer packaging
