Overview In this role you will advance wafer bonding process technology to enable next-generation DRAM. You will work within Micron's global DRAM Technology Development team to drive yield, reliability, and cost improvements, while evaluating new equipment and materials. You will lead cross-functional initiatives and apply AI/ML methods to accelerate problem solving and innovation. This is a hands-on, impact-focused role with opportunities to shape manufacturing readiness and process baselines.
Compensation / Benefits- Health, Savings, Wellbeing Programs
- Stock Purchase Discount
- generous Time Off Program
- medical/dental/vision plans
- paid time off and holidays
- income protection and paid family leave
Responsibilities- Develop and optimize wafer bonding processes for next-gen DRAM technologies
- Plan and execute DOEs to improve process performance and reliability
- Drive yield improvement, cost reduction, and productivity initiatives via data-driven methods
- Evaluate and qualify new equipment, materials, and process technologies for development and manufacturing
- Collaborate with manufacturing, suppliers, and cross-functional teams on process improvements
- Leverage advanced analytics, AI/ML tools to solve complex problems and accelerate innovation
- Manage process, equipment, and material evaluations and improvements across steps
- Oversee new process baseline qualifications and supplier collaboration to achieve quality, cost, and risk objectives
Key requirements- PhD with 3+ years, Master's with 5+ years, or Bachelor's with 7+ years of semiconductor industry experience
- 5+ years of experience developing and driving wafer bonding technologies or related processes
- Hands-on experience with direct bonding, hybrid bonding, wafer thinning, or de-bonding technologies
- Strong analytical and problem-solving skills with a track record of data-driven process improvements
- Proven ability to lead complex technical challenges across cross-functional teams
- Experience developing and optimizing semiconductor processes to improve quality, reliability, yield, cost, and manufacturing readiness
- Experience supporting DRAM, memory, or advanced semiconductor technology development (preferred)
- Knowledge of DOE methodology, statistical analysis, root-cause investigation, and process characterization (preferred)
- Experience qualifying new equipment, materials, and process technologies for high-volume manufacturing (preferred)
- Experience using AI/ML/LLMs to improve engineering productivity (preferred)
- Strong written, verbal, and presentation communication skills (preferred)
- cross-functional collaboration
- leadership
- problem-solving
- wafer bonding technologies (direct/hybrid)
- DOE planning and analysis
- statistical analysis and process characterization
