Overview In this role you lead Advanced Engineering and Process Development to bridge technology roadmaps with scalable manufacturing. You will design, optimize, and deploy advanced processes and equipment for AI-enabled hardware, expanding regional manufacturing and driving global standardization. You'll work with product design teams to deliver manufacturable solutions while accelerating timelines and maintaining quality and safety. This is a high-impact leadership position at Celestica's Richardson hub with global scope and growth.
Responsibilities- Manage customer-specific process and equipment development from concept to production launch
- Collaborate with Product Design groups and customers to optimize DFM, DFA, and DFT for cost-effective manufacturing
- Oversee SMEs in high-power ASIC thermal modeling, TIM, signal integrity, and material science interactions
- Drive strategies for large, complex L11 integration and next-gen rack-level solutions
- Foster accountability and accelerate development timelines from 12 months to 5-9 months without compromising quality or safety
- Lead phased talent transition and establish global standards and application support across Dallas hub and sites abroad
Key requirements- 15+ years of engineering leadership in semiconductor, advanced electronic assembly, or hardware manufacturing
- Bachelor's degree in Mechanical Engineering, Electrical Engineering, Materials Science, Chemical Engineering, or equivalent experience
- Strong knowledge of large ASIC packages, silicon thermal dynamics, CTE, tight-pitch PCB manufacturing
- Experience with high-power cooling, thermal modeling, and liquid TIMs
- Proven ability to manage high-value, multi-functional engineering projects with executive visibility
- Excellent stakeholder management with Tier 1 hyperscale customers and global site leaders
- Willingness to travel up to 25% (domestic and international)
- velocity-driven leadership
- strong negotiation and presentation skills
- cross-functional collaboration
- Semiconductor & Advanced Packaging expertise
- Advanced Thermal Management
- Testing Methodologies
