Overview As Sr Principal PCB Design Engineer, you will lead the design of advanced high-performance probe card PCBs for next-generation semiconductor test solutions. You will act as a technical leader across multiple engineering functions, driving quality, schedule, and design methodologies. You'll tackle high-density, high-speed, and high-current architectures, including HBM and advanced packaging, shaping the performance and reliability of critical test hardware. This role offers impact across global teams and supplier ecosystems.
Compensation / Benefits- medical, dental, vision insurance
- life insurance and disability coverage
- 401(k) with company match
- employee stock purchase plan (ESPP)
- paid time off
- quarterly profit-sharing bonuses
Responsibilities- Lead architecture, layout, and implementation of highly complex multilayer PCB designs for semiconductor test and probe card applications
- Develop solutions for high-density, high-speed, and high-current products including HBM and advanced packaging technologies
- Drive design execution from concept through release ensuring schedule, quality, and manufacturability
- Collaborate with SI, EDE, Applications, ME, Manufacturing, and Supply Chain to optimize performance and reliability
- Define stackups, routing strategies, impedance requirements, power distribution, and manufacturability
- Perform constraint management, signal integrity, power integrity, and design rule compliance
- Provide technical leadership and mentoring for PCB designers across regions
- Establish and improve design methodologies, standards, checklists, automation workflows, and best practices
- Lead technical reviews and support root cause analysis of design, manufacturing, and field issues
- Evaluate and deploy new design tools, technologies, and automation to improve efficiency
- Support customer escalations and critical business priorities requiring advanced expertise
Key requirements- PCB design experience in high-speed digital, RF, mixed-signal, or semiconductor products
- Expert knowledge of PCB layout tools such as Cadence Allegro, Siemens Xpedition, or equivalent
- Strong understanding of high-speed signal routing, power distribution networks, impedance, DFM, DFA, and PCB fabrication/assembly technologies
- Experience designing complex multilayer boards with HDI, BGAs, microvias, and advanced packaging
- Ability to drive technically challenging projects with minimal supervision
- Strong problem-solving, communication, and leadership skills
- Experience supporting semiconductor test hardware, probe cards, or advanced packaging
- Knowledge of signal integrity and power integrity concepts
- Experience working in global engineering organizations
- Mentoring PCB designers and leading technical initiatives
- Familiarity with automation, scripting, and PCB design process optimization
- Leadership competencies: technical authority, engineering excellence, cross-program direction
- Skills: Allegro PCB Designer, High Speed PCB Design, Multilayer PCB Design, PCB Layout, PCB Fabrication, PCBA, PCB Design Software
- strong communication
- leadership
- mentoring
- Cadence Allegro
- Siemens Xpedition
- HDI
