Overview In this role you will lead the unified test and product engineering strategy for power semiconductor modules, ICs, and controllers, aligning global teams to deliver scalable, cost-competitive, high-quality products. You drive end-to-end product execution from silicon bring-up to sustaining operations, focusing on yield ramp, qualification, and manufacturing readiness. You will shape cross-functional collaboration with Design, Quality, and Operations to meet performance and reliability targets. The opportunity centers on building scalable processes, accelerating NPI, and improving efficiency at OSAT sites while influencing overall product competitiveness.
Responsibilities- Define and execute a unified test and product engineering strategy across global teams
- Lead NPI, yield ramp, and sustaining operations with scalable processes
- Own full product lifecycle from silicon bring-up to sustaining and qualification
- Drive yield ramp, manage excursions, optimize cost through yield and test efficiency
- Ensure manufacturing readiness, production stability, and resolution of yield issues across fab, assembly, and test
- Own product KPIs and manage ECO/PCN change control processes; collaborate with design on DfY and specification alignment
- Develop and deploy wafer sort, final test, and characterization solutions; optimize test coverage and cost
- Reduce test time, improve multisite efficiency, and standardize ATE platforms for high-volume manufacturing
- Resolve yield excursions, test escapes, and customer returns with Quality and Reliability teams
- Establish monitoring systems to align product performance, test limits, and reliability targets
- Coordinate with Operations and manufacturing to ensure capacity, readiness, and continuous improvement
- Own budget, headcount, and capital planning; drive hiring, development, and succession planning
Key requirements- Bachelor's degree in Electrical Engineering or related field; 15+ years semiconductor experience in test and/or product engineering with global leadership
- Strong technical background in power semiconductors (Si, SiC, GaN, modules, or power ICs)
- Proven track record in yield ramp, cost optimization, and high-volume manufacturing execution
- Deep understanding of ATE, characterization, and yield analysis; cross-functional product lifecycle experience
- Experience driving end-to-end product delivery and cross-functional collaboration
- cross-functional collaboration
- leadership and people development
- strategic thinking and problem solving
- power semiconductors (Si, SiC, GaN, modules, power ICs)
- ATE, characterization, and yield analysis
- test automation and data analytics in manufacturing
