T
Not Specified Permanent

Langhorne, Pennsylvania · USA job

MGR II R&D/PRODUCT DVL ENGINEERING

TE connectivity

Langhorne, Pennsylvania

Job description

Overview

In this role you lead a regional/global team of signal integrity engineers to design and validate high speed products for data centers and wireless infrastructure. You guide SI simulations, connector design, and data driven improvements while aligning the tech roadmap with market needs. You foster a high performance culture and support employee wellbeing in a dynamic environment. This position offers meaningful impact by advancing high speed connectivity solutions within TE's Digital Data Networks business.

Compensation / Benefits
  • Health insurance
  • 401(k)
  • disability
  • life insurance
  • employee stock purchase plan
  • paid time off
Responsibilities
  • Lead a regional/global team of SI engineers to define signal integrity requirements for new products
  • Oversee SI simulations for multiple high speed standards and establish appropriate methodologies
  • Guide connector design and qualifications from a SI perspective for data driven improvements
  • Produce actionable recommendations from design reviews and simulation results
  • Communicate actions and impacts to management, customers, and technical communities
  • Align technology roadmap with market trends and customer needs and implement accordingly
  • Foster innovation by combining traditional approaches with external knowledge
  • Manage diverse teams across regions, providing coaching and development
  • Prioritize work and resource loading to support wellbeing and work life balance
Key requirements
  • Bachelor's degree in Electrical Engineering or equivalent; Master's degree preferred
  • 10+ years in electrical/RF or PCB design
  • 3+ years progressive leadership/people management in a regional environment
  • Strong understanding of electromagnetic theory and circuit behavior
  • Expert with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST or equivalents)
  • Proficient with 3D CAD tools (SpaceClaim preferred, AutoCAD, Creo or equivalents)
  • Proficient with high speed test equipment (VNA, TDR, BERT)
  • Experience with interconnect design or electronic packaging, focusing on high speed differential connectors/cable assemblies, RF connectors, and channel integration
  • leadership and people management
  • clear communication with stakeholders
  • collaboration across cross functional teams
  • Signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST)
  • 3D CAD (SpaceClaim, AutoCAD, Creo)
  • High speed test equipment (VNA, TDR, BERT)

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