Overview In this role you will lead a cross-functional team to drive the release of new MCU-driven products for automotive and industrial markets, ensuring ROI and on-time delivery. You will collaborate with design, marketing, validation, manufacturing, and external partners to manage schedules and quality. You'll plan projects end-to-end and report progress to senior management, addressing risks and customer needs. This is a chance to shape reliable, high-performance MCUs for safety-critical applications in a global setting.
Compensation / Benefits- competitive pay and benefits
Responsibilities- Lead cross-functional team to release new products and ensure ROI
- Coordinate with wafer fabrication, assembly & test sites to meet schedule, cost, and quality targets
- Plan projects using MS Project from Assess Opportunity Phase to Release to Market
- Provide clear direction to internal teams and external suppliers
- Drive team motivation to achieve flawless execution
- Provide weekly/monthly project updates to senior management
- Interact with customers on project status, milestones, and deliveries
- Perform product reliability and characterization to meet specs and manufacturing requirements
- Collaborate with failure analysis to determine root causes of reliability issues
- Maintain up-to-date project schedules with milestones
- Develop and implement qualification plans
- Communicate weekly project status to management
- Coordinate material logistics and prioritization of shipments/assembly/test
- Maintain Galileo system per new product development guidelines
- Success measured by growth in new products and ROI
Key requirements- Bachelor in Electrical Engineering
- 2+ years of engineering experience with project engineering/management on highly complex products/projects
- Proven leadership capabilities in leading multifaceted global organizations
- Track record in indirect management and influence
- Ability to manage multiple projects simultaneously
- Effective coordination of global development teams
- Clear direction to internal and external teams
- Knowledge of device packaging and wafer fabrication process
- Reliability requirements and tri-temp characterization using statistical analysis
- Experience with MS Project for project planning
