Overview In this role you will develop and execute thermal and mechanical modeling and test programs for advanced semiconductor packaging and board-level assemblies. You will characterize thermal performance, validate mechanical robustness, and link simulations to test data to support high-volume Starlink production. You work with cross-functional teams to integrate test insights into product development and ramp. This is a mission-driven position at SpaceX, focusing on reliable hardware for the Starlink constellation and its global impact.
Responsibilities- Develop and run thermal and mechanical finite element models and simulations to predict behavior under operational conditions
- Create process models to support production line bring-up and packaging process investigations
- Design, set up, and execute thermal and mechanical test campaigns
- Perform board-level thermal characterization to evaluate heat spreading and junction temperatures
- Operate and maintain thermal test equipment (thermal chambers, thermocouples, infrared cameras)
- Analyze test data, correlate with models, provide actionable feedback to packaging, design, and manufacturing teams
- Support new package and board designs through test planning, execution, and data reporting
- Collaborate cross-functionally with packaging, hardware design, production operations, and quality to integrate test insights
Key requirements- Bachelor's degree in engineering, math, or science
- 1+ years of experience with thermal or mechanical modeling and testing in industry or academia
- cross-functional collaboration
- data analysis and problem solving
- effective communication
- finite element analysis or thermal simulation tools (ANSYS, Abaqus, COMSOL, Flotherm, Icepak)
- 3D and reduced-order thermal/mechanical modeling
- simulation-data correlation with physical test results
