Overview As a Process Engineer in the APTD Bonding team, you will start up, develop and optimize bonding processes to boost product quality and reliability. You'll drive yield improvements, productivity, and cost reductions while solving line problems using structured methods. You will diagnose assembly process issues and steer evaluation and optimization initiatives across processes, equipment, and materials. This role offers the chance to qualify new processes and support cross-site portability, contributing to Micron's AI-focused memory innovations.
Compensation / Benefits- medical, dental, and vision plans
- paid time off
- paid holidays
- paid family leave
- retirement and savings programs
- benefits guide on
Responsibilities- Develop and modify process formulations; define equipment needs and processing methods
- Identify, diagnose, and resolve assembly process-related problems
- Coordinate process, equipment, and material evaluation/optimization initiatives and implement changes
- Validate and scale new process baselines for new product introductions
- Support SPC/FDC/RMS/APC and site-to-site portability
- Audit suppliers to achieve quality, cost, and risk objectives
Key requirements- Bachelor in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics + 5 years of relevant industry experience
- Knowledge of Advanced Package Integration and DRAM, NAND, or other memory products
- Experience with DOE, SPC, defect analysis and data analysis
- Experience in semiconductor process engineering and packaging with understanding of process/equipment interactions
- Ability to resolve complex issues through root-cause or model-based problem solving
- Problem solving
- Cross-functional collaboration
- Leadership (preferred)
- Design of experiments (DOE)
- Statistical Process Control (SPC)
- FMEA and 8D problem solving
