Senior Staff Engineer, Thermal Simulation

In this role you will lead hands-on thermal modeling and analysis for semiconductor packages and advanced packaging, driving reliable thermal solutions from early architecture to design validation. You will collaborate with Samsung customers and cross-functional teams to translate requirements into simulation methodologies and influence materials and design choices. You'll stay at the forefront of thermal technologies, delivering clear engineering insights through reports and reviews. This is a pivotal role for advancing high-performance packaging and electronics cooling across our product portfolio.

• paid time off (4+ weeks)
• fertility/adoption stipend
• medical/dental/vision/401k
• charitable giving match
• emotional wellness resources
• onsite cafe and gym

• Lead hands-on thermal modeling and analysis for semiconductor packages and electronic systems
• Build and analyze models using ANSYS Icepak and Siemens Flotherm, including setup, boundary conditions, solver execution and post-processing
• Influence architecture, materials selection, and structural integrity of high-performance packaging under manufacturing and usage conditions
• Analyze simulation and measurement results to enhance product reliability
• Support customers throughout product development from architecture studies to optimization and recommendations
• Translate customer requirements into simulation methodologies and develop best-in-class standards
• Create innovative thermal solutions for challenging semiconductor and packaging applications
• Communicate technical findings via reports, presentations, and customer reviews
• Stay current with emerging technologies in advanced packaging, HBM, 2.5D/3D and high-power electronics cooling

• PhD in Mechanical Engineering, Thermal/Fluids, or related Physical Science with 10+ years of industry experience (preferred)
• Experience with CFD tools: ANSYS Icepak, Flotherm, CELSIUS
• Ability to independently build models, perform analysis, troubleshoot results and develop recommendations
• Strong understanding of heat transfer, fluid mechanics, thermal management, and electronics cooling fundamentals
• Fundamental understanding of IC chip/package architectures and thermal design constraints
• Working experience in SiP (System in Package) thermal analysis
• Excellent communication and collaboration skills in cross-functional and cross-cultural teams

• collaborative and cross-cultural mindset
• avid learner with curiosity and resilience
• data-driven decision-making
• CFD and thermal analysis
• ANSYS Icepak
• Siemens Flotherm