Overview In this role you will lead microelectronics packaging in a cleanroom and guide a team of assemblers to meet strict quality standards. You will work within Draper's multidisciplinary environment to develop and optimize packaging processes for advanced devices. You'll tackle challenges in wire bonding, die attach, and lid sealing, enabling reliable, high-performance packages. This position offers a chance to influence manufacturing quality, process scalability, and skill development in a mission-driven R&D setting.
Compensation / Benefits- workplace flexibility
- employee clubs (e.g., photography, yoga)
- health and finance workshops
- offsite social events
- discounts to local museums and cultural activities
- life outside work balance
Responsibilities- Lead cleanroom packaging operations and ensure compliance with MIL-PRF-38534, MIL-PRF-38535 and MIL-STD-883
- Work with advanced packaging processes such as wire bonding, die attach, and lid sealing
- Program and operate advanced equipment (die bonders, wire bonders, seam welders)
- Assemble diverse packaging types (ceramic LCCs, flatpacks, CQFP, TSOP, ASICs, MCMs)
- Train and certify staff in cleanroom processes and QML Q and V level inspections
- Support design concepts and process modifications through data-driven analysis
Key requirements- 5-7 years in Product Engineering or related field
- Experience with DOE, SPC, and FMEA implementation
- Ability to operate in a full cleanroom gowning environment and maintain ANSI/ESD S20.20 awareness
- Familiarity with QFP, TQFP, SOP, TSOP, QFN, Flip Chip, Cu pillar FC, BGA, CSP, FOWLP, 2.5DIC, 3DIC packaging is beneficial
- Bachelor's or Master's in Mechanical Engineering or related field
- Experience training or mentoring engineers
- Curiosity-driven problem solving
- Strong collaboration and communication across multidisciplinary teams
- Ability to manage multiple competing tasks in a fast-paced environment
- Packaging process engineering for microelectronics
- Cleanroom manufacturing and ESD awareness
- DOE, SPC, FMEA methodologies
