Senior System and Manufacturing CoDesign Architect - Power, Thermal and Packaging

In this role you will push the physical boundaries of GPU/system performance by anticipating constraints in packaging, power, and thermal domains and crafting cross-domain solutions. You'll influence silicon, packaging, firmware, and manufacturing to ensure future NVIDIA products remain ahead of physics limits. This role centers on turning hard physical constraints into actionable strategies that unlock next-generation leaps. You'll work across disciplines to shape high-impact, testable, performance-per-watt architectures.

• equity
• comprehensive benefits package
• base salary with competitive range
• hybrid work arrangement

• Gather and analyze constraints for packaging, power delivery, and thermal dissipation aligned to roadmaps; predict and address impacts on competitiveness
• Develop cross-domain solutions spanning silicon features, packaging, firmware/hardware co-design, and DFX updates to ensure performance and reliability
• Evaluate emerging packaging technologies for voltage/frequency, noise, reliability, and testability; weigh trade-offs across the system
• Drive system-manufacturing co-design to improve performance, efficiency, and provisioning across power, thermal, and related domains
• Follow opportunities to where the highest impact lies, adapting focus as needed across related domains

• BS/MS/PhD in EE, Physics, or CE (or equivalent experience)
• 12+ years of relevant experience
• Deep understanding of power delivery, thermal dissipation, and current density in high-performance GPU/CPU systems
• Proven ability to translate physical-limit trends into measurable impact and solutions
• Demonstrated cross-functional influence across building, packaging, manufacturing, and test organizations

• Exceptional work ethic
• Ability to elevate discussions to solve real problems
• Cross-functional collaboration and influence
• Power delivery
• Thermal management
• Packaging technologies