Overview As Principal Research Scientist, you lead and shape next-generation wafer-level interconnects, BEOL, and WLP research to enable new product capabilities and accelerate technology adoption. You will guide multi-disciplinary R&D, develop funded programs, and translate concepts into manufacturable solutions, collaborating with product teams, partners, and government sponsors. Your leadership and technical vision will drive transformative packaging technologies with measurable impact on Qorvo's commercial success. This role offers a chance to mentor teams and shape technology roadmaps in a fast-moving, innovative environment.
Responsibilities- Drive next-generation wafer-level interconnect, BEOL, WLP, and heterogeneous integration research
- Author and influence technology roadmaps aligned to long-term product and innovation strategies
- Lead proposal development, capture, and execution of funded programs as Principal Investigator
- Provide technical project leadership including planning, risk management, and milestone delivery
- Lead hands-on ideation, development, troubleshooting, and execution for wafer and wafer-level packaging technologies
- Collaborate with technicians, junior engineers, and process engineers to execute activities efficiently
- Communicate program status, technical results, and strategic recommendations to senior leadership, customers, and external stakeholders
- Generate intellectual property including patents and invention disclosures
- Mentor and develop junior engineers and researchers while fostering technical excellence
Key requirements- Ph.D. in a related field
- 10+ years of hands-on semiconductor R&D in cleanroom environments
- 5+ years as PI or technical lead for advanced R&D programs
- Expertise in BEOL processing and/or wafer-level packaging (WLP) technologies
- Hands-on experience with advanced metallization, dielectric integration, and interconnect process development
- Experience with GaAs and/or GaN device fabrication, process integration, and characterization
- Knowledge of device and mask layout design for analog and RF applications
- Proven ability to lead small, multidisciplinary R&D teams
- Strong written and verbal communication, including proposal development and executive presentations
- leadership
- communication
- mentoring
- BEOL processing
- wafer-level packaging (WLP)
- advanced metallization
