Position: Process Engineer (REQ# L5428) Location: Santa Clara, CA Duties: Design and Execute Plasma Etch Experiments. Plan and conduct complex plasma etching experiments on customer wafers using in-house etch chambers, ensuring compliance with safety protocols and process integrity. Wafer Characterization and Data Analysis. Measure and analyze critical wafer performance metrics such as profile and CD using SEM, TEM, and CD-SEM. Interpret results with deep technical insight to identify trends, anomalies, and process sensitivities. Root Cause Analysis and Hypothesis-Driven Development. Troubleshoot complex process issues through structured root cause analysis. Formulate hypotheses, propose potential mechanisms, and design follow-up experiments to validate findings. Customer-Facing Communication and Collaboration. Prepare clear, data-driven presentations to communicate progress and findings to customers across global time zones. Lead technical discussions to align goals, share insights, and incorporate feedback. Documentation and Reporting. Generate high-quality internal and external documentation, including technical reports, experiment logs, and customer-facing presentations that clearly articulate conclusions and next steps. Technology Evaluation and PTOR Qualification. Drive process development toward meeting customer specifications for PTOR (Production Tool of Record) selection, ensuring the tools readiness for high-volume manufacturing. Requirements: Masters degree or foreign degree equivalent in Civil Engineering, Environmental Engineering, Electrical Engineering, Chemical Engineering, Materials engineering, or related field plus 3 years of experience in any occupation where Process Engineering experience was gained. In the alternative, the employer will also accept a Doctor of Philosophy (PhD) or foreign degree equivalent in Civil Engineering, Environmental Engineering, Electrical Engineering, Chemical Engineering, Materials Engineering, or related field . This position also requires education or experience with: 1. Plasmasurface interactions and etch mechanisms (including plasma physics and chemistry, gas-phase and surface reactions, and materials interactions relevant to dry etching); 2. Experimental design and quantitative data analysis; 3. Designing and executing controlled experiments, including DOE-based approaches; 4. Analyzing experimental data to extract trends; 5. Semiconductor device manufacturing process (Such as how a semiconductor device is made and characterized); 6. Hypothesis driven problem solving and root cause analysis; 7. Documenting and presenting technical findings through reports and presentations; and 8. Communicating complex results to technical stakeholders and collaborating effectively in cross-functional team. Salary: $148,154.,784.00per year To apply: Email your resume to and include the Req in the subject line.
